Component and Assembly Issues - Component Mounting Strategies
6 important questions on Component and Assembly Issues - Component Mounting Strategies
Which are the two most important factors that influence component mounting strategies?
- The types of component packages that are required by the circuit.
- The process capabilities of the product assembly manufacturer.
Why is it extremely important that the designer communicate with both the circuit engineer that is selecting components for the circuit and the production engineer at the assembly location ?
What dictates the mounting options that are available to the designer?
the component package:
- through hole components have a different set of considerations for mounting than do surface mounted components.
- Also assemblies that use both through-hole and SMD have another set of considerations.
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A board of type 1A, 2C,... Give the complete classification!
- type 1: components only on one side
type 2: components on both sides - classes:
- A: through-hole components mounted only
- B: surface mount components only
- C: simplistic through-hole and surface mounting intermixed assembly
- X,Y,Z: complex intermixed assembly
X fine-pitch and BGA;
Y ultrafine pitch, chip scale;
Z ultrafine pitch, COB, flip chip and TAB
Why are spacing considerations important?
- it is important that the designer provide adequate clearance to the probing pad where the in-circuit test fixture can determine that a proper connection has been made between the component and the circuitry.
- Proper clearance should be provided for all test points as well as having sufficient clearance around the parts to allow ease of repair.
Other important considerations related to component style, their attachment, and their usage? #3
- Mechanical interference (usable area)
- Thermal
- Physical support
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