Printed Board Characteristics - Design Standards to Meet Fabrication and Assembly Goals
4 important questions on Printed Board Characteristics - Design Standards to Meet Fabrication and Assembly Goals
Which are the key cost drivers relative to bare board manufacture?
- All laminate materials - both panel utilization and material selection,
e.g. mixed dielectrics, non-standard materials, etc. - Number of layers
- Total number of holes
- Minimum hole size
- Plating requirements
- Minimum feature size/pitch
- Mechanical tolerances, e.g. plating thickness, hole-to-hole,
edge-to-edge dimensions, etc. - Solder mask requirements
- Electrical test parameters
- Technology
What defines the channel width?
the size of the feature (annular ring or land size).
In order to evaluate conformance to printed board fabrication and assembly goals, which design checks must, as a minimum,be performed?
- Signal layer checks
- Plane layer checks
- Solder mask layer checks
- Solder paste layer checks
- Glue stencil checks
- Legend layer checks.
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Which are the fundamental elements of good design practice assessed during the design review?
- use proven land pattern geometry
- consistent orientation of devices
- polarized devices in one direction
- uniform device clearance and distribution
- Use devices that have standard configurations
- reasonable mixed technology concepts
- Design for efficient assembly processing
- assembly is testable from one side
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