Design considerations - Plating Characteristics for Conductors and Holes
6 important questions on Design considerations - Plating Characteristics for Conductors and Holes
Which three general methods are commomly used for plating metals on to circuit boards?
- immersion plating
- electroless plating
- electroplating
Dry metallization (sputtering) used in semiconductor processing is not commonly used for PCB fabrication.
What is the primary function of metallic coatings?
Additional benefits by specific platings may offer:
- corrosion prevention of the copper circuitry
- improved long-term solderability
- wear resistance
The metal used for surface protection should be compatible with the joining material. Why?
Solder coating combines well with solder.
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What is immersion plating?
What is electroless plating?
How can the layout of the circuit effect the plating process?
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